Preparation Method of Electronic Ceramic Substrate

Electronic ceramic substrate materials have the following properties:

(1) High thermal conductivity to meet the heat dissipation requirements of the device;

(2) Good heat resistance, meeting the high temperature (greater than 200°C) application requirements of power devices;

(3) The thermal expansion coefficient is matched to match the thermal expansion coefficient of the chip material to reduce the thermal stress of the package;

(4) The dielectric constant is small, the high-frequency characteristics are good, the signal transmission time of the device is reduced, and the signal transmission rate is improved;

(5) High mechanical strength, meeting the mechanical performance requirements in the process of device packaging and application;

(6) Good corrosion resistance, can withstand strong acid, strong alkali, boiling water, organic solution and other erosion;

(7) The structure is compact and can meet the needs of airtight packaging of electronic devices;

(8) Other performance requirements, such as for the application of optoelectronic devices, also put forward requirements for the color and reflectivity of the ceramic substrate material.

Alumina electronic ceramic substrate forming methods mainly include rolling method, casting method and gel casting method. The latter two methods use deionized water instead of organic solvents, which can not only reduce costs, but also be conducive to environmental protection. It is one of the main research directions for the preparation of Al2O3 electronic ceramic sheets.