The polishing process of rare earth materials.

Both physical and chemical aspects of the polishing process are important.The interaction between the polished surface and the polished material particles can be divided into physical and chemical interactions. Physical action is a qualitative description of the polished material under pressure to remove impurities from the surface of the polished material. Chemical action is in the polishing material surface and polishing particles are attracted to each other, through the chemical interaction in the micro-reaction area, adhesion is polished material surface impurity particles; When the two are separated, part of the workpiece material still adheres to the particle surface, and then it is removed from the surface of the polishing material. From the physical point of view, the polishing process is the polishing material and the polished material surface of the subtle cutting action. Remove the uneven micromark structure on the surface to form a smooth plane.