Alumina polishing compounds

At present, SiO2 abrasive polishing fluid is mostly used in sapphire substrate polishing in China. Since SiO2 has a low hardness and a low polishing rate, and α-Al2O3 abrasive has a good polishing rate on the substrate with a higher hardness, nano-scaleα-Al2O3 abrasive has a good application prospect in chemical mechanical polishing. In recent years, the application of nanometer alumina in polishing fluid has become a research hotspot of CMP technology. The preparation of alumina particles with regular shape and appropriate particle size is the basis of the preparation of alumina polishing fluid. However, the stability of single alumina abrasives is poor. Surface modification of alumina on the basis of existing nano alumina to improve the stability of polishing fluid and reduce polishing scratches is the research focus of alumina polishing fluid at present. Stable alumina polishing fluid mixed with other polishing fluids can effectively improve the polishing efficiency.